Relaxed metal pitch memory architectures

ABSTRACT

A relaxed metal pitch architecture may include a bit line and a first active area string and a second active area string. The bit line may be directly coupled to the first active area string and to the second active area string. The relaxed metal pitch architecture may be applied to a non-volatile memory structure.

TECHNICAL FIELD

This disclosure relates generally to non-volatile memory semiconductordevices, including flash memory arrays.

BACKGROUND

Flash memory is non-volatile, which means that it stores information sothat the memory does not need power to maintain the information. Flashmemory data may be stored in floating gates (FGs), which are part of afield effect transistor (FET), and which gates are relatively isolatedfrom other structures in a semiconductor device. The floating gates maybe based on the floating-gate avalanche-injection metal oxidesemiconductor (FAMOS transistor) which is essentially a complimentarymetal oxide semiconductor (CMOS) FET that includes the FG isolatedbetween the gate and source/drain terminals.

The pressure upon the microelectronic device fabricator to everminiaturize, motivates reducing the size of back-end-of-line (BEOL)structures such as the metallization.

BRIEF DESCRIPTION OF THE DRAWINGS

The above mentioned issues are addressed by the present disclosure andwill be understood by reading and studying the following specification,of which the Figures are a part.

FIG. 1 is a cross-section and perspective elevation of a portion of aflash memory array according to an embodiment;

FIG. 2 is a top plan of a portion of a flash memory array according toan embodiment;

FIG. 3 is a cross-section and perspective elevation of a portion of aflash memory array according to an embodiment;

FIG. 4 is a process flow diagram that illustrates selected processembodiments;

FIG. 5 is a top view of a semiconductor wafer or substrate containingsemiconductor dies according to an embodiment;

FIG. 6 is a block diagram of a circuit module according to anembodiment;

FIG. 7 is a block diagram of a memory module according to an embodiment;

FIG. 8 is a block diagram of an electronic system according to anembodiment;

FIG. 9 is a block diagram of a memory system according to an embodiment;and

FIG. 10 is a block diagram of a computer system according to anembodiment.

DETAILED DESCRIPTION

Various embodiments relate to achieving read/write operations innon-volatile memory cells of flash memory arrays by using a reducednumber of bit lines and bit contacts. Many embodiments therefore relateto relaxed-pitch metallization architectures of flash memory arrays.

FIG. 1 is a cross-section and perspective elevation of a portion of aflash memory array 100 according to an embodiment. A bit line 110 isdisposed above a semiconductor substrate 112. The bit line 110 isillustrated in wireframe to reveal structures behind and beneath it. Thesemiconductor substrate 112 includes semiconductive regions andnon-semiconductive regions. A first active area string 114 is disposedbetween a first shallow-trench isolation (STI) 116 and an intermediateSTI 118. The first active area string 114 communicates with the bit line114 through a first contact 120. A second active area string 122 isdisposed between the intermediate STI 118 and a second STI 124. Thesecond active area string 122 communicates with the bit line 110 througha second contact 126. The bit line 110 contacts both the first activearea string 114 and the second active area string 122, only through therespective first contact 120 and second contact 126. In other words, thebit line 110 makes contact with both the first active area string 114and the second active area string 122. Also, it is the first contact 120that contacts the first active area string 114, and it is the secondcontact 126 that contacts the second active area string 122.

An active area string 128 is spaced apart from the first active areastring 114 by the first STI 116. This active area string 128communicates through a contact 130. An active area string 132 is spacedapart from the second active area string 122 by the second STI 124. Thisactive area string 132 communicates through a contact 134.

A first select gate 136 is disposed above the semiconductor substrate112, and it crosses perpendicular to the first active area string 114and the second active area string 122. A subsequent select gate 138 isalso disposed above the semiconductor substrate 112, and it crossesperpendicular to the first active area string 114 and the second activearea string 122. An intermediate select gate 140 is disposed above thesemiconductor substrate 112, between the first select gate 136 and thesubsequent select gate 138, and it also crosses perpendicular to thefirst active area string 114 and the second active area string 122. Wordlines that are used to access the flash memory array 100 are disposedparallel to the select gates and peripheral to the illustrated portionsof the flash memory array 100. The flash memory array 100 can be dividedinto a first side that has a boundary at the intermediate select gate140 and is in the direction of the first select gate 136, and a secondside that has a boundary also at the intermediate select gate 140 and isin the direction of the subsequent select gate 138.

In a process embodiment during fabrication of the flash memory array100, the first active area string 114 may be processed to include a lowthreshold voltage region (LVTR) 142 and a HVTR (HVTR) 144. In anembodiment, formation of the LVTR 142 and the HVTR 144 may beaccomplished by first forming a HVTR gate oxide layer 146, which isdepicted with a dashed reference line because it has depth below theHVTR 144. The HVTR gate oxide layer 146 is blanket formed. Subsequently,selected portions of the HVTR gate oxide layer 146 may be masked and anetch may be carried out in the unmasked portions of the etch field, tothin the HVTR gate oxide layer 146 such that a lower-voltage gate oxidelayer 148 is formed for the LVTR 142. A medium voltage threshold redoing(MVTR) is formed in a similar manner.

In an embodiment, the HVTR gate oxide layer 146 and the lower-voltagegate oxide layer 148 may be substantially equivalent in thickness, butthe LVTR 142 and the HVTR 144 may be differently doped to allow inducedsemiconductance at different select gate voltages.

The second active area string 122 likewise depicts a LVTR 150 and a HVTR152. In an embodiment, the HVTR 152 and the LVTR 150 may be preparedwith the respective HVTR gate oxide layer 146 and lower-voltage gateoxide layer 148, which is depicted with a dashed reference line becauseit has depth below the HVTR 152. In an embodiment, the LVTR 150 and theHVTR 152 may be prepared by differently doping the respective accessesto allow a different threshold voltage.

In a method embodiment, the first active area string 114 is read at theLVTR 142. In this method embodiment, although the bit line 110 may beelectrically coupled to the LVTR 142 and the HVTR 144 in the firstactive area string 114, and to the HVTR 152 and the LVTR 150 in thesecond active area string 122, the bit line 110 only reads the firstactive area string 114 at the LVTR 142. This method is accomplished byactivating the requisite word line, activating the first select gate 136at the requisite high voltage, and activating the intermediate selectgate 140 at the requisite low voltage. The subsequent select gate 138 isnot activated and consequently data cannot be extracted from either ofthe HVTR 144 nor LVTR 150. Data can be extracted, however, from thefirst active area string 114 at the LVTR 142. But data cannot beextracted from the second active area string 122 at the HVTR 152 becausethe intermediate select gate 140 was activated only at the requisite lowvoltage.

FIG. 2 is a top plan of a portion of a flash memory array 200 accordingto an embodiment. A first bit line 210 is disposed above a semiconductorsubstrate 212. The first bit line 210 is illustrated in wireframe toreveal structures beneath it. The semiconductor substrate 212 includessemiconductive regions and non-semiconductive regions. A first activearea string 214 is disposed between a first STI 216 and an intermediateSTI 218. The first active area string 214 communicates with the firstbit line 210 through a first contact 220. An active area string 228 isspaced apart from the first active area string 214 by the first STI 216.This active area string 228 communicates through a contact 230 to thefirst bit line 210.

A second bit line 260 is also disposed above the semiconductor substrate212 and is adjacent the first bit line 210. The second bit line 260 isillustrated in wireframe to reveal structures beneath it. In anembodiment, the second bit line 260 is used as a voltage referenceduring a read/write using the first bit line 210. A second active areastring 222 is disposed between the intermediate STI 218 and a second STI224. The second active area string 222 communicates with the first bitline 210 through a second contact 226. An active area string 232 isspaced apart from the second active area string 222 by the second STI224. This active area string 232 communicates through a contact 234 tothe second bit line 260.

A first select gate 236 is disposed above the semiconductor substrate212, and crosses perpendicular to the first active area string 214 andthe second active area string 222. All select gate structures depictedin FIG. 2 are illustrated as dashed lines for clarity. A subsequentselect gate 238 is also disposed above the semiconductor substrate 212,and crosses perpendicular to the first active area string 214 and thesecond active area string 222. An intermediate select gate 240 isdisposed above the semiconductor substrate 212, between the first selectgate 236 and the subsequent select gate 238, and it also crossesperpendicular to the first active area string 214 and the second activearea string 222. A fourth select gate 239 is disposed above thesemiconductor substrate 212, between the first select gate 236 and thesubsequent select gate 238, and it also crosses perpendicular to thefirst active area string 214 and the second active area string 222. Afifth select gate 241 is disposed above the semiconductor substrate 212,between the subsequent select gate 238 and the subsequent select gate238, and it also crosses perpendicular to the first active area string214 and the second active area string 222. Word lines that are used toaccess the flash memory array 200 are disposed parallel to the selectgates and peripheral to the illustrated portions of the flash memoryarray 200.

The first active area string 214 and the second active area string 222are processed to include various occurrences of HVTR 252 and 244, MVTR243 and 249, and LVTR 242 and 250. In an embodiment, formation of theLVTR 242 and 250, the MVTR 243 and 249, and the HVTR 252 and 244 isaccomplished by first forming a HVTR gate oxide layer. The HVTR gateoxide layer is blanket formed. Subsequently, selected portions of theHVTR gate oxide layer is masked and a first etch is carried out in theunmasked spaces to thin the HVTR gate oxide layer such that a MVTR gateoxide layer is formed for the MVTR 243 and 249. Subsequently, the HVTR252 and 244 and the MVTR 243 and 249 are masked and a subsequent etch iscarried out in the unmasked spaces to thin the gate oxide layer suchthat the LVTR 242 and 250 are formed.

In an embodiment, the gate oxide is not thinned, but the respectivehigh- medium- and LVTR 252 and 244, 243 and 249, and 242 and 250,respectively, are differently doped to allow induced semiconductance atdifferent select gate voltages. In a method embodiment, the active areastring 228 may be read at the MVTR 243. In this method embodiment,although the first bit line 210 may be electrically coupled to eightvoltage accesses, the first bit line 210 only reads the active areastring 228 at the MVTR 243. This method may begin by activating therequisite word line and the intermediate select gate 240. Also, thefirst select gate 236 may be activated at the medium voltage, and thefourth select gate 239 may be activated at the requisite low voltage.The subsequent select gate 238 and the fifth select gate 241 are notactivated and consequently none of the LVTR 250, MVTR 249, or HVTR 244are able to give up their data. The active area string 228, however,gives up its information at the MVTR 243. But the first active areastring 214 cannot give up its information according to an embodimentdata at the MVTR 243 because the fourth select gate 239 is activatedonly at the requisite low voltage and consequently, data cannot flow tothe first contact 220. Data can only flow to the contact 230 from theactive area string 228 and not the first active area string 214 becausethe fourth select gate 239 was activated at the requisite low voltage.

FIG. 3 is a cross-section and perspective elevation of a portion of aflash memory array 300 according to an embodiment. A bit line 310 isdisposed above a semiconductor substrate 312. The bit line 310 isillustrated in wireframe to reveal structures behind and beneath it. Thesemiconductor substrate 312 includes semiconductive regions andnon-semiconductive regions. A first active area string 314 is disposedbetween a first STI 316 and an intermediate STI 318. The first activearea string 314 communicates with the bit line 310 through a contact320. In other words, the first active area string 314 contacts the bitline 310 through the contact 320. A second active area string 322 isdisposed between the intermediate STI 318 and a second STI 324. Thesecond active area string 322 communicates with the bit line 310 alsothrough the contact 320. In other words, the second active area string322 contacts the bit line 310 through the contact 320. The contact 320straddles the intermediate STI 318 and touches down on both the firstactive area string 314 and the second active area string 322. In otherwords, the contact 320 contacts both the first active area string 314and the second active area string 322.

An active area string 328 is spaced apart from the first active areastring 314 by the first STI 316. An active area string 332 is spacedapart from the second active area string 322 by the second STI 324.

A first select gate 336 is disposed above the semiconductor substrate312, and it crosses perpendicular to the first active area string 314and the second active area string 322. A second select gate 338 is alsodisposed above the semiconductor substrate 312, and it crossesperpendicular to the first active area string 314 and the second activearea string 322. The second select gate 338 is illustrated in wireframeand phantom lines in order to reveal structures behind and below it. Athird select gate 340 is disposed above the semiconductor substrate 312,and it also crosses perpendicular to the first active area string 314and the second active area string 322. And a fourth select gate 348 isdisposed above the semiconductor substrate 312, and it also crossesperpendicular to the first active area string 314 and the second activearea string 322. Word lines that are used to access the flash memoryarray 300 are disposed parallel to the select gates and peripheral tothe illustrated portions of the flash memory array 300.

In a process embodiment during fabrication of the flash memory array300, the first active area string 314 may be processed to include a LVTR342, a HVTR 344, a LVTR 350, and a HVTR 352. In an embodiment, formationof the LVTR 342 and 350, and the HVTR 344 and 352 is accomplished byfirst forming a HVTR gate oxide layer 346, which is depicted with adashed reference line because it has depth below the HVTR 344. The HVTRgate oxide layer 346 may be blanket formed. Subsequently, selectedportions of the HVTR gate oxide layer 346 is masked and an etch iscarried out in the unmasked spaces to thin the HVTR gate oxide layer 346such that a LVTR gate oxide layer 354 is formed for the LVTR 342 and350.

In an embodiment, the HVTR gate oxide layer 346 and the LVTR gate oxidelayer 354 are substantially equivalent in thickness, but the LVTR 342and 350, and the HVTR 344 and 352 are differently doped to allow inducedsemiconductance at different selected gate voltages. The second activearea string 322 likewise depicts LVTR 342 and 350 and HVTR 344 and 352.

In a method embodiment, the first active area string 314 is read at theLVTR 342. In this method embodiment, although the bit line 310 iselectrically coupled to all of the accesses in both the first activearea string 314 and the second active area string 322, the bit line 310only reads the first active area string 314 at the LVTR 342. This methodis accomplished by activating the requisite word line, activating thefirst select gate 336 at the requisite low voltage, and activating thesecond select gate 338 at the requisite high voltage. The respectivethird and fourth select gates 340 and 348 are not activated andconsequently neither the HVTR 344 nor the LVTR 350 are able to give uptheir data. The first active area string 314, however, gives up itsinformation at the LVTR 342. But the second active area string 322 doesnot give up its data at the HVTR 352 because the first select gate 336was activated only at the requisite low voltage.

FIG. 4 is a process flow diagram 400 that illustrates selected processembodiments.

At 440, the process may include directly connecting a first bit lineover a semiconductive substrate, to a first active area string and to asecond active area string. In an embodiment, the process commences andterminates at 440.

At 410, the process may include forming a plurality of voltage accessesin the first active-area string. In an embodiment, the plurality ofvoltage accesses is two: a high and a low. In a non-limiting example,the LVTR 142 is formed and the HVTR 144 is formed, either by etching thegate oxide layer 148 or by relative doping, as illustrated in FIG. 1. Inan embodiment, the plurality of voltage accesses is three; a high, amedium, and a low.

At 420, the process may include forming a plurality of select gatesabove the semiconductive substrate. The number of the plurality canrange from three to five, as respectively illustrated in FIGS. 1, 2 and3.

At 430, the process may include forming a contact above thesemiconductive substrate. In an embodiment, the contact may contact thefirst active area string and the second active area string asillustrated in FIG. 3.

Though they are both non-volatile flash memory technologies, NAND andNOR flash meet different design needs based on their individualattributes. NOR flash is faster with read and random access, which makesit useful for code storage in devices such as personal digitalassistants (PDAs) and cell phones. NOR flash, however is slower withwrite and erase functions compared to NAND flash. NOR flash also has alarger memory cell size than NAND flash. NAND flash on the other hand,offers fast write/erase capability. NAND is therefore typically used forstoring large data blocks such as for MP3 players, multi-function cellphones, digital cameras and USB drives.

It should be noted that the methods described herein do not have to beexecuted in the order described, or in any particular order. Moreover,various activities described with respect to the methods identifiedherein can be executed in iterative, serial, or parallel fashion. In anembodiment, the process may commence at 410 and may terminate at 440.

FIGS. 5 through 10 illustrate other embodiments. The processes andstructures that are achieved in the various embodiments are inventivelyapplicable to a variety of devices and apparatuses. Specific systems canbe made by process embodiments, and such systems may include anembodiment or embodiments of the structure. For example, a chip packagecan contain a relaxed-pitch architecture flash memory array according toan embodiment. In another embodiment, the relaxed-pitch architectureflash memory array is part of an electrical device that includes thesemiconductor substrate in a chip package and the chip package is partof a memory module or part of a chipset. In another embodiment, thememory module is part of a DRAM memory module that is inserted into ahost such as a motherboard or a digital computer. In another embodiment,specific systems can be made that include the relaxed-pitch architectureflash memory array. For example, a chip package may contain a substratesuch as one set forth in this disclosure. In another embodiment, therelaxed-pitch architecture flash memory array is part of an electricaldevice that includes the semiconductor substrate in a chip package andthe chip package is part of a memory module or part of a chipset. Inanother embodiment, the memory module is part of a flash DRAM memorymodule that is inserted into a host such as a motherboard or a digitalcomputer. In another embodiment, the relaxed-pitch architecture flashmemory array structure is part of an electronic system. In anotherembodiment, the relaxed-pitch architecture flash memory array is part ofa flash memory device that in turn is part of a chipset such as a basicinput-output system (BIOS) for an electrical device.

FIG. 5 is a top view of a semiconductor wafer 500 or substratecontaining semiconductor dice according to an embodiment. With referenceto FIG. 5, a semiconductor die 510 is produced from the silicon wafer500 that contains at least one of the relaxed-pitch architecture flashmemory array structures depicted in FIGS. 1-3. A die 510 may comprise anindividual pattern, typically rectangular, on a substrate such assubstrate 112 (FIG. 1) or substrate 212 (FIG. 2) or semiconductorsubstrate 312 (FIG. 3) that contains circuitry to perform a specificfunction. A semiconductor wafer 500 will typically contain a repeatedpattern of dice 510 containing the same functionality. The dice 510 canfurther contain additional circuitry to extend to such complex devicesas a monolithic processor with multiple functionality. One or more dice510 are typically packaged in a protective casing (not shown) with leadsextending therefrom (not shown) providing access to the circuitry ofindividual dice 510 for unilateral or bilateral communication andcontrol. In an embodiment, a die 510 is encased in a host such as a chippackage (not shown) or a chip-scale package (CSP).

FIG. 6 is a block diagram of a circuit module 600 according to anembodiment. As shown in FIG. 6, two or more dice 510, at least one ofwhich contains at least one relaxed-pitch architecture flash memoryarray structure similar to or identical to those depicted in FIGS. 1-3,respectively, in accordance with various embodiments may be combined,with or without protective casing, into a host such as a circuit module600 to enhance or extend the functionality of an individual die 510. Inan embodiment, the circuit module 600 may be a combination of dice 510representing a variety of functions, or a combination of dice 510containing the same functionality. Some examples of a circuit module 600include memory modules, device drivers, power modules, communicationmodems, processor modules, and application-specific modules and caninclude multi-layer, multi-chip modules. In an embodiment, the circuitmodule 600 is a sub-component of a variety of electronic systems, suchas a clock, a television, a cell phone, a personal computer, anautomobile, an industrial control system, an aircraft, a hand-helddevice, and others. In an embodiment, the circuit module 600 has avariety of leads 610 extending therefrom providing unilateral orbilateral communication and control.

FIG. 7 is a block diagram of a memory module 700 according to anembodiment. FIG. 7 shows one embodiment of a circuit module as a memorymodule 700 containing a relaxed-pitch architecture flash memory arraystructure similar to or identical to those depicted in FIGS. 1-3. Thememory module 700 is a host that generally depicts a Single In-lineMemory Module (SIMM) or a Dual In-line Memory Module (DIMM). A SIMM orDIMM may generally be a printed circuit board (PCB) or other supportcontaining a series of memory devices. While a SIMM will have a singlein-line set of contacts or leads, a DIMM will have a set of leads oneach side of the support with each set representing separateinput/output (I/O) signals.

In an embodiment, the memory module 700 is a flash memory card. In anembodiment, the memory module 700 is a flash memory card that isportable and connectable though a universal serial bus (USB) drive port.The memory module 700 contains multiple memory devices 710 contained ona support 715, the number depending upon the desired bus width and thedesire for parity. In an embodiment, the memory module 700 containsmemory devices 710 on both sides of the support 715. In an embodiment,the memory module 700 accepts a command signal from an externalcontroller (not shown) on a command link 720 and provides for data inputand data output on data links 730. The command link 720 and data links730 are connected to leads 740 extending from the support 715. The leads740 are shown for conceptual purposes and are not limited to thepositions shown in FIG. 7.

FIG. 8 is a block diagram of an electronic system 800 according to anembodiment. FIG. 8 shows another host type such as an electronic system800 containing one or more memory modules 700, as described above,containing at least one relaxed-pitch architecture flash memory arraystructure embodiment. The electronic system 800 generally contains auser interface 810. The user interface 810 provides a user of theelectronic system 800 with some form of control or observation of theresults of the electronic system 800. Some examples of the userinterface 810 include the keyboard, pointing device, monitor, andprinter of a personal computer; the tuning dial, display, and speakersof a radio; the ignition switch or gas pedal of an automobile; and thecard reader, keypad, display, and currency dispenser of an automatedteller machine. The user interface 810 can further describe access portsprovided to the electronic system 800. Access ports are used to connectan electronic system to the more tangible user interface componentspreviously exemplified. One or more of the memory modules 700 can be aprocessor providing some form of manipulation, control or direction ofinputs from or outputs to the user interface 810, or of otherinformation either preprogrammed into, or otherwise provided to, theelectronic system 800. As will be apparent from the lists of examplespreviously given, the electronic system 800 will often contain certainmechanical components (not shown) in addition to the memory modules 700and the user interface 810. It will be appreciated that the one or morememory modules 700 in the electronic system 800 can be replaced by asingle integrated circuit. Furthermore, the electronic system 800 may bea sub-component of a larger electronic system.

FIG. 9 is a block diagram of a memory system 900 according to anembodiment. The memory system 900 acts as a higher-level host thatcontains one or more memory devices 710 as described above, including atleast one relaxed-pitch architecture flash memory array structureembodiment, and a memory controller 910 that can also include circuitrythat is connected with a buried digit line structure as set forthherein. The memory controller 910 provides and controls a bidirectionalinterface between the memory system 900 and an external system bus 920.The memory system 900 accepts a command signal from the external systembus 920 and relays it to the one or more memory devices 710 on a commandlink 930. The memory system 900 provides for data input and data outputbetween the one or more memory devices 710 and the external system bus920 on data links 940.

FIG. 10 is a block diagram of a computer system 1000 according to anembodiment The computer system 1000 contains a processor 1010 and amemory system 900 as described above, housed in a computer unit 1015.The computer system 1000 is but one example of an electronic systemcontaining another electronic system (i.e. the memory system 900, as asub-component). In an embodiment, the computer system 1000 contains anI/O circuit 1020 that is coupled to the processor 1010 and the memorysystem 900. In an embodiment, the computer system 1000 contains userinterface components that are coupled to the I/O circuit 1020. In anembodiment, a plurality of relaxed-pitch architecture flash memory arraystructures is coupled to one of a plurality of I/O pads or pins 1030 ofthe I/O circuit 1020. The I/O circuit 1020 can then be coupled to atleast one of a monitor 1040, a printer 1050, a bulk storage device 1060,a keyboard 1070 and a pointing device 1080. It will be appreciated thatother components are often associated with the computer system 1000 suchas modems, device driver cards, additional storage devices, etc. It willfurther be appreciated that the processor 1010, the memory system 900,the I/O circuit 1020, and partially isolated structures or data storagedevices of computer system 1000 can be incorporated on a singleintegrated circuit. Such single package processing units may reduce thecommunication time between the processor 1010 and the memory system1000.

This Detailed Description refers to the accompanying drawings that show,by way of illustration, specific aspects and embodiments in which thepresent disclosure may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice thedisclosed embodiments. Other embodiments may be utilized and structural,logical, and electrical changes may be made without departing from thescope of the present disclosure. The various embodiments are notnecessarily mutually exclusive, as some embodiments can be combined withone or more other embodiments to form new embodiments.

The term “horizontal” as used in this document is defined as a planeparallel to the conventional plane or surface of a wafer or substrate,regardless of the orientation of the wafer or substrate. The term“vertical” refers to a direction perpendicular to the horizontal asdefined above. Prepositions, such as “on”, “side” (as in “sidewall”),“higher”, “lower”, “over” and “under” are defined with respect to theconventional plane or surface being on the top surface of the wafer orsubstrate, regardless of the orientation of the wafer or substrate. TheDetailed Description is, therefore, not to be taken in a limiting sense,and the scope of this disclosure is defined only by the appended claims,along with the full scope of equivalents to which such claims areentitled.

The Abstract is provided to comply with 37 C.F.R. §1.72(b), requiring anabstract that will allow the reader to quickly ascertain the nature ofthe technical disclosure. It is submitted with the understanding that itwill not be used to interpret or limit the scope or meaning of theclaims. In addition, in the foregoing Detailed Description, variousfeatures may be grouped together to streamline the disclosure. Thismethod of disclosure is not to be interpreted as reflecting an intentionthat the claimed embodiments require more features than are expresslyrecited in each claim. Rather, as the following claims reflect,inventive subject matter may lie in less than all features of a singledisclosed embodiment. Thus the following claims are hereby incorporatedinto the Detailed Description, with each claim standing on its own as aseparate embodiment.

1. A flash memory array comprising: a bit line; and a first active areastring and a second active area string, wherein the bit line contactsthe first active area string and the second active area string.
 2. Theflash memory array of claim 1, wherein the flash memory array includestransistors connected to the bit line.
 3. The flash memory of claim 1,wherein the flash memory array includes less than three transistorsconnected to the bit line.
 4. The flash memory array of claim 2, whereinthe bit line contacts a first contact, wherein the first contactcontacts the first active area string, and wherein the first active areastring includes a low threshold voltage region and a high voltagethreshold region.
 5. The flash memory array of claim 2, wherein the bitline contacts a first contact and a second contact, wherein the firstcontact contacts the first active area string, wherein the first activearea string includes a low threshold voltage region at a first side anda high voltage threshold region at a second side, wherein the secondcontact contacts the second active area string, and wherein the secondactive area string includes a low threshold voltage region at the secondside and a high voltage threshold region at the first side.
 6. The flashmemory array of claim 1, wherein the flash memory array includes onlytwo transistors connected to the bit line.
 7. The flash memory array ofclaim 1, wherein the flash memory array includes different transistorsconnected to the bit line, further including select gates havingdifferent threshold voltages in the different transistors.
 8. The flashmemory array of claim 1, wherein the flash memory array includes fiveselect gates coupled to the bit line.
 9. The flash memory array of claim8, wherein the bit line is a first bit line that contacts a firstcontact and a second contact, further including: a second bit linecoupled to the five select gates, wherein the second bit line contacts athird contact and a fourth contact, wherein the third contact contacts athird active area string, and the forth contact contacts a fourth activearea string.
 10. The flash memory array of claim 8, wherein the bit lineis a first bit line that contacts a first contact and a second contact,further including: a second bit line coupled to the five select gates,wherein the second bit line contacts a third contact and a fourthcontact, wherein the first active area string includes a sequence ofaccesses including medium-voltage and high-voltage at a first side andhigh-voltage and medium-voltage at a second side, and wherein the secondactive area string includes a sequence of accesses including low-voltageand medium-voltage at a first side and low-voltage and medium-voltage ata second side.
 11. The flash memory array of claim 1, wherein the bitline contacts a bit contact, and wherein the bit contact contacts thefirst active area string and the second active area string.
 12. Theflash memory array of claim 11, wherein the first active area stringincludes a sequence of accesses including low threshold voltage regionand high threshold voltage region at a first side and high thresholdvoltage region and low threshold voltage region at a second side, andwherein the second active area string includes a sequence of accessesincluding low threshold voltage region and high threshold voltage regionat a first side and high threshold voltage region and low thresholdvoltage at a second side.
 13. The flash memory array of claim 1, whereinthe flash memory array includes four select gates coupled to the bitline.
 14. The flash memory array of claim 1, wherein the flash memoryarray is a NAND flash memory array.
 15. A process comprising: forming afirst bit line over a semiconductive substrate including a first activearea string and a second active area string, wherein the first bit linecontacts the first active area string and the second active area string.16. The process of claim 15, wherein select gates are formed over theactive area strings.
 17. The process of claim 15, further including:forming three select gates below the first bit line, wherein the firstactive area string contacts a first contact and the first contactcontacts the first bit line, and wherein the second active area stringcontacts a second contact and the second contact contacts the first bitline.
 18. The process of claim 15, wherein the first active area stringis prepared by a process further including: forming a low thresholdvoltage region; and forming a high voltage threshold region.
 19. Theprocess of claim 18, wherein the first active area string includes agate oxide, the process further including: forming the low thresholdvoltage region by etching the gate oxide; and forming the high voltagethreshold region
 20. The process of claim 18, wherein the first activearea string includes a gate oxide, the process further including:forming the low threshold voltage region by doping the semiconductivesubstrate differently than the high voltage threshold region.
 21. Theprocess of claim 18, further including forming five select gates belowthe first bit line, wherein the first active area string contacts afirst contact and the first contact contacts the first bit line, andwherein the second active area string contacts a second contact and thesecond contact contacts the first bit line.
 22. The process of claim 15,in the first active area string, the process further including: forminga low threshold voltage region; forming a medium voltage thresholdregion; and forming a high voltage threshold region.
 23. The process ofclaim 15, in the first active area string, the process further includingforming more than one threshold voltage region, wherein the more thanone threshold voltage regions have different threshold voltages.
 24. Theprocess of claim 22, wherein the first active area string includes agate oxide, the process further including: forming the low thresholdvoltage region by etching the gate oxide to a first amount; and formingthe medium voltage threshold region to a second amount that is greaterthan the first amount.
 25. The process of claim 22, wherein the firstactive area string includes a gate oxide, the process further including:forming the low threshold voltage region by doping the semiconductivesubstrate differently than either of the medium voltage threshold regionand the high voltage threshold region.
 26. The process of claim 22,further including forming four select gates below the first bit line,wherein the first active area string contacts a first contact and thefirst contact contacts the first bit line, and wherein the second activearea string contacts the first contact.
 27. A computer system,comprising: a processor; a memory system coupled to the processor,including: a bit line; a first active area string and a second activearea string, wherein the bit line contacts the first active area stringand the second active area string; and an input/output (I/O) circuitcoupled to the processor and the memory system.
 28. The computer systemof claim 27, wherein the first active area string is part of a NANDflash active area string.
 29. The computer system of claim 27, whereinthe flash memory array includes select gates selected from a groupconsisting of three select gates, four select gates, and five selectgates, coupled to the bit line.
 30. The computer system according toclaim 27, wherein the processor is disposed in a host selected from aclock, a television, a cell phone, a personal computer, an automobile,an industrial control system, an aircraft, or a hand-held device. 31.The computer system according to claim 27, wherein the memory system isdisposed in a host selected from a clock, a television, a cell phone, apersonal computer, an automobile, an industrial control system, anaircraft, or a hand-held device.